Gold Wire Bonding Machine Ultrasonic Bonding Machine

Welding principle: This machine uses the principle of ultrasonic friction to achieve surface welding of different media, which is a physical change process. First, the head end of the gold wire must be processed to form a sphere (this machine uses negative electron high pressure to form a sphere), and the metal surface to be welded must be preheated (welding can also be done without heating, depending on whether the sample requires heating treatment); Then, under the combined action of time and pressure, the gold wire ball produces plastic deformation on the metal welding surface, so that the two media can achieve reliable contact, and through ultrasonic friction vibration, the two metal atoms form a metal bond under the action of atomic affinity, realizing the welding of gold wire leads. Gold wire ball welding is superior to silicon aluminum wire welding in terms of electrical performance and environmental application.

Power supply	220VAC±10% (AC110V can be customized), 50Hz, 300W, reliable grounding is required.
Power consumption	maximum 300W.
Applicable gold wire diameter	16~50μm (0.7~2 mil).
Welding temperature	room temperature~400℃.
Ultrasonic power	four channels 0~5W, continuously adjustable in two levels
Ultrasonic time	5-200ms±5% (20ms/grid)
Welding time	two channels 0~200ms.
Welding pressure	two channels 25~180g
Minimum welding time	0.4s/line
Maximum automatic span from one weld to two welds	not less than 4mm in both directions, and the arch wire adjustable range is 0~6mm.
Tail wire length	0~2mm
Gold ball size	Negative electrons form a ball, with adjustable diameter.
Clamp moving range	Φ25mm.
Microscope	Standard two-speed microscope (15/30 times), optional camera and display.
Overall dimensions	520 (length) × 460 (width) × 550 (height) mm.
Weight	about 28Kg.

Features:

• One-way welding can memorize the data of two lines, which is convenient for the left and right brackets to use one-way welding on the same side.
• During two-way welding, after welding the first line, it will automatically move to the top of the second line, roughly aligning with the first welding point of the second line, which can improve efficiency and protect the arc of the first line.
• During two-way welding, the second inspection height and arch wire height of the two lines can be adjusted separately to facilitate the welding of brackets with different second welding heights.
• The arc heightening function has three schemes of arc 1, arc 2 and arc 3, and multiple arcs can be selected. You can achieve any arc you want. For high-power tube brackets, deep cup brackets and piranha brackets with high arc requirements, the qualified rate will be greatly improved.
• The second welding ball filling function can greatly improve the weldability of the second welding and reduce the dead point rate.
• Automatic film feeding 1 step or 2 step selection. For large distance brackets such as Φ8mm and 10mm, choosing two steps each time will greatly improve production efficiency.
• Continuous film feeding function can improve efficiency for rework brackets.
• Chopping knife detection function can detect whether the chopping knife is installed correctly, greatly reducing artificial cold welding.
• Ultrasonic power 4-channel output can try to ensure that the two welding points of the two side lines are basically consistent. At the same time, because the welding point parameters on the wafer bracket are different, different welding power on the wafer and the bracket can be selected to ensure that the welding points on the wafer and the ball welding on the bracket meet the requirements.
• The ball burning performance is greatly improved, and a smaller first weld (ball weld) and a more reliable second weld can be obtained.

  High-definition camera and display are optional, and the technical parameters are as follows:

1. Embedded system with FPGA+ARM architecture. Runs LINUX3.10 operating system.
2. Dual-core Cortex-A9 processor with a main frequency of 1Ghz and up to 1GbDDR3 memory.
3. The system has its own measurement function, which can measure the height and span of the line and the size of the solder joint with a high probability.
4. Adopts 1/2-inch backlit CMOS Sensor.
5. Up to 2 million high-speed image acquisition, with a resolution of 1920×1080@60fps
6. Two USB ports for connecting wireless mouse or keyboard.
7. HDMI high-definition interface ensures clear and bright images.
8. The new operation interface is more intuitive and convenient.
9. Adopts popular flat button design, beautiful and convenient.
10. Advanced high-light suppression function better solves the strong reflection phenomenon.
11. Simplified Chinese, Traditional Chinese and English are available for selection.
12. Display size: 24 inches.