Ultrasonic Sputtering Target Bonding Machine XW-STB300

This Ultrasonic Sputtering Target Bonding Machine is designed for soldering of sputtering target in order to join the backing plate. The machine works on the indium or tin coating for a variety of materials such as molybdenum, aluminum, ITO glass and copper. This ultrasonic soldering machine features a long life span and is easy to operate. Application: Indium or Tin(Sn) Coating for Sputtering Target ( ITO, AL, Mo, Cu ). Ultrasonic sputtering target bonding machine is widely used for soldering various kinds of sputtering targets such as ITO, Al, Mo, Cr, Si and so on without flux.   Features:

• Successful Soldering of any kinds of sputtering target;
• Full Digital Control;
• Ultrasonic Amplitude Adjustable : 5-100%.

Technical Parameters:

Model	XW-STB3 00
Power Supply	220V 50/60HZ
Power	300W~1000W
Frequency	10~38KHz
Generator Type	Digital automatic frequency tracking, generator can be adjusted the output amplitude from 5% to 95%
Dimension	310*310*130(mm)
Iron Size	Can be customized
Avail Soldering Material	Indium or Tin(Sn) Coating for Sputtering Target ( ITO, AL, Mo,Cu)
Weight	3kg
Warranty	1 year