XW-WB2000 Ultrasonic Wire Bonding Machine

Features:

• Ultrasonic Bonding Technology: Utilizes ultrasonic vibrations to create a solid-state bond between the wire and the bonding pad on the semiconductor substrate or IC. This technology ensures a reliable and strong connection without the need for heat or flux.
• High Precision: Offers high precision in wire placement and bonding due to precise control of ultrasonic energy and bonding force. This is crucial for ensuring consistent quality and reliability of the bonds.
• Bonding Modes: Supports different bonding modes such as ball bonding and wedge bonding, depending on the application requirements and the type of wire being used (e.g., aluminum, gold, copper).
• Compatibility with Various Substrates: Compatible with a wide range of substrate materials commonly used in semiconductor and electronic device manufacturing, including silicon, ceramic, and various types of PCB materials.
• Clean and Non-Destructive Bonding: Ultrasonic bonding is a clean process that does not introduce contaminants or damage to the substrate or wire. It is non-destructive to delicate components and ensures high yield rates in production.
• Reliability and Durability: Designed for continuous operation in high-volume production environments, ultrasonic wire bonding machines are built to be durable and reliable, minimizing downtime and maintenance needs.