Ultrasonic Wire Bonding Machine
Provide reliable performance ultrasonic wire bonding machine
With years of ultrasonic technology research and rich industry application experience, Xiaowei has launched ultrasonic wire bonding machine in semiconductor manufacturing field.
Our ultrasonic wire bonder is at the leading level in China in terms of bonding precision, bonding speed, bonding force control precision, welding wire diameter range, etc., which provides you with stable and reliable purchasing options.
Reliable ultrasonic wire bonding machines
The multi-functional ultrasonic lead bonding machine independently developed and manufactured by xiaowei realizes the precision connection of lead wires and substrate pads through precise mechanical structure and highly integrated hardware and software control, which can be used for bonding of various types of lead wires, such as gold wires, platinum wires, copper wires, silver wires, aluminum wires, and gold ribbons.
In terms of improving the stability of the equipment, we use dual-drive control to achieve better synchronization and operational stability.
In terms of guaranteeing bonding quality, the product is equipped with an advanced welding quality online monitoring system, which can monitor the welding quality in real time, and adopts non-destructive tensile force testing technology, which can detect problems in the ultrasonic welding process in time to avoid the production of defective products, and we have also added a high-pixel camera auxiliary device, which can clearly detect the position of cleaver, cutter and wire nozzle, making the bonding head adjustment more accurate and fast.
In addition, Xiaowei also provides automatic ultrasonic wire bonder to realize automatic material replenishment, helping customers to further improve production efficiency.
What is wire bonding?
In the semiconductor process, “bonding” refers to the fixing of a wafer chip to a substrate. Just as an engine is used to power an automobile, chip bonding is used to electrically connect the chip to the outside world by attaching the semiconductor chip to a lead frame or printed circuit board (PCB). After the completion of the chip bonding, should ensure that the chip can withstand the physical pressure generated by the package, and can dissipate the heat generated during the operation of the chip. If necessary, constant electrical conductivity or a high level of insulation must be achieved.
Ultrasonic wire bonding Process
The chip is first fixed to a metal lead frame, and then fine metal wires are bonded to the chip and the lead frame sequentially using a lead bonding process. The main conductive wires used in the wire bonding process are gold, copper and aluminum wires. The principle of wire bonding welding is to use ultrasonic way to destroy the oxidation layer and pollution of the welded surface, resulting in plastic deformation, making the lead wire and the welded surface close contact to the inter-atomic gravitational range and lead to the diffusion of atoms between the interface and the formation of welded joints.
Frequently Asked Questions
Ultrasonic lead bonding, an electronic interconnection technology in which metal wires are combined with heat, pressure, and ultrasonic energy, is a solid-state soldering process.
Wire bonding is a critical process in semiconductor manufacturing, and the quality of bonding is directly related to the performance and reliability of the entire semiconductor packaging device. Data show that about 25% of the failure of semiconductor devices is caused by chip interconnections, so high-quality lead bonding can improve chip performance and extend the service life.
Ultrasonic lead bonding equipment is the key equipment for semiconductor packaging production, also known as wire bonding machine, is the use of ultrasonic frequency of mechanical vibration energy, the semiconductor chip on the Pad and the lead frame with a conductive metal wire connection.
The material of bonding wire is divided into three kinds of gold wire, aluminum wire and copper wire, of which the commonly used ones are aluminum wire and gold wire, and the copper wire is generally prone to oxidation and thus has a high degree of difficulty in bonding. xiaowei has achieved a higher level of bonding process through innovative technology to ensure the quality of copper wire bonding.